Full Stack ASIC Design Service
Advanced Packaging Solutions
Advanced Packaging Solutions
As performance demands rise and form factors shrink, Advanced Packaging Solutions have become essential in modern ASIC design. These cutting-edge packaging technologies enhance integration, improve thermal management, and boost electrical performance, all while reducing the footprint. These solutions ensure that products meet both the technical and commercial needs of contemporary applications.
Key Offerings
2.5D Packaging with Interposers
Integrating multiple dies on a silicon interposer for high-bandwidth communication with reduced power consumption.
3D Integrated Circuit (3D-IC) Packaging
Utilizing 3D-IC technology to vertically stack dies, enabling unprecedented integration density and performance.
Fan-Out Wafer-Level Packaging (FO-WLP)
Extending I/O to a larger footprint, delivering high performance in a compact package.
System-in-Package (SiP) Solutions
Integrating multiple components within a single package, streamlining communication and reducing system size.
Flip-Chip Packaging
Implementing flip-chip technology for high-performance interconnects, ensuring enhanced signal integrity, thermal efficiency, and optimized power delivery.
Wire Bonding Packaging
Providing cost-effective wire bonding solutions, ideal for lower-power designs requiring reliable connections.
Wafer-Level Chip-Scale Packaging (WLCSP)
Minimizing the form factor, making it ideal for space-constrained applications such as IoT and mobile devices.
Thermal and Power Management Solutions
Employing advanced thermal dissipation and power management techniques to ensure reliable operation under high-power conditions.
Package Simulation, Testing, and Qualification
Conducting simulations and rigorous testing to validate thermal, mechanical, and electrical performance.
Benefits of our Advanced Packaging Solutions
Increased Integration Density
Enables higher levels of integration within the package.
Improved Performance and Efficiency
Optimized for superior performance and energy efficiency.
Customization and Flexibility
Tailored solutions to meet specific project needs.
Comprehensive Support
Full support throughout the design, testing, and production phases.
Cost Efficiency
Designed to balance cost-effectiveness with high performance.
Whether you’re looking for customized high-performance chip designs or comprehensive solutions, our expert team is ready to support you every step of the way. Contact us to collaborate and shape the core of next-generation technology.
